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Performance Specification 電力特性：

V max  = Maximum operating voltage device can withstand without damage at rated current (Imax).

V max  = 元件在額定電流下能承受的最大電壓。

I max   = Maximum fault current device can withstand without damage at rated voltage (V max).

I max   = 元件在額定電壓下能承受的最大電流。

I hold   = Hold Current. Maximum current device will not trip in 25°C still air.

I hold   = 在25°C靜止空氣環(huán)境中，產(chǎn)品不動(dòng)作的最大電流。

I trip    = Trip Current. Minimum current at which the device will always trip in 25°C still air.

I trip    = 在25°C靜止空氣環(huán)境中，最小動(dòng)作電流。

Pd      = Power dissipation when device is in the tripped state in 25°C still air environment at rated voltage.

Pd      = 在25°C靜止空氣環(huán)境中，產(chǎn)品動(dòng)作狀態(tài)下的消耗功率。

Ri min/max  = Minimum/Maximum device resistance prior to tripping at 25°C.

Ri min/max  = 25°C溫度條件下的初始阻值（焊接前）。

R1max  = Maximum device resistance is measured one hour post reflow.

R1max  = 25°C溫度條件下，焊接一小時(shí)後的最大阻值。

CAUTION : Operation beyond the specified ratings may result in damage and possible arcing and flame.

注意：超出指定額定值的操作，可能會(huì)導(dǎo)致?lián)p傷和可能產(chǎn)生電弧和火焰。

Environmental Specifications 環(huán)境規(guī)範(fàn)：

Thermal Derading Chart 熱減額圖表                                                

Recommended Hold Current(A) at Ambient Temperature(°C) 環(huán)境溫度（°C）下的推薦保持電流（A）

Thermal Derating Curve                                  Average Time-Current Curve

熱減額曲線                                                        平均時(shí)間電流曲線

Soldering Parameters 焊接參數(shù)

Recommended reflux method, infrared light cake, gas phase furnace, hot air furnace, nitrogen environment, lead-free welding.

推薦的回流方法，紅外光餅，氣相爐，熱空氣爐中，氮?dú)猸h(huán)境，無(wú)鉛焊接。

Recommended maximum thickness of tin brushing is 0.25mm.

建議刷錫厚度最大為0.25mm。

Devices can be cleaned using standard industry methods and solvents.

設(shè)備可以使用行業(yè)標(biāo)準(zhǔn)的方法和溶劑清洗。

Note 1:All temperature refer to topside of the package, measured on the package body surface.

注1：所有溫度均指在包裝體表面量測(cè)的包裝頂部。

Note 2:If the reflux temperature exceeds the recommended thin application requirements, the product may not meet the performance requirements

注2：如果回流溫度超過(guò)推薦瘦敷要求，產(chǎn)品可能無(wú)法滯足性能要求。

Physical Dimensions 尺寸規(guī)格 (mm.)  

Recommended Pad Layout 建議焊墊佈局(mm.)  

Termination Pad Characteristics 焊端特性：

Solder end information: copper plating and tin plating.

焊端資料：鍍銅鍍錫。

Solderability of welding ends: in accordance with EIA specification RS186-9E and ANSI/J-STD-002 category 3.

焊端可焊性：符合EIA規(guī)範(fàn)RS186-9E和ANSI/J-STD-002類(lèi)別 3。

Packaging Quantity 包裝數(shù)量

8mm magnetic tape, 7-inch reel per EIA-481-1 

8亳米磁帶，7英寸卷軸每EIA-481-1

Tape And Reel Specifications (mm)   

磁帶和卷軸規(guī)格（mm）